“Making the World a Better, and Greener Place”

Roger Lee, President & CEO of TF Semiconductor Solutions started his professional journey when he joined Micron Technology in Boise, Idaho in 1987, when the company had only a single building and a few R&D engineers. He was one of a handful of technologists at Micron then under the leadership of highly respected semiconductor technology genius, Tyler Lowrey. Today Micron is a $50B Global Company with more than 20,000 employees worldwide. Roger was the founding father of Micron Technology's flash memory technology. He and his team built the Flash Memory Division from ground zero, introduced Micron’s first flash products and established Micron's flash program which now contributes billions of USD in sales each year to Micron. Roger holds more than 150 U.S. patents in semiconductor devices and processes, including many key technology patents.

"TF Semiconductor Solutions’ long history stretches back over 100-years to the original Telefunken Electronics launched in Germany in 1903. Since then Telefunken has been a leader in the electronics industry."

TF Semiconductor Solutions’ long DNA history stretches back over 100-years to the original Telefunken Electronics, GmbH launched in Germany in 1903. Since then Telefunken has been a leader in the electronics industry. In 2014, Telefunken Semiconductors America (TSI) board of directors made the decision to focus on manufacturing and technology foundry. Roger saw the value in TSI’s green power IC products group and lead a management buyout. In the subsequent years Roger has led TF Semi to a leadership position in the PMIC-Gate Driver market in terms of product offerings, shipping over 50 million semiconductor chips in just a few short years. With over 30-years’ experience in the semiconductor business and technology holding key executive or key engineering leadership roles at some of the major companies including senior fellow and head of flash memory at Micron Technology in Boise, Idaho, senior vice president at SMIC in Shanghai, COO at FMIC in Shenzhen, COO and CEO at Telefunken Semiconductors USA/GmbH in Roseville, California and in Heilbronn, Germany, Roger’s international executive managerial skill is one of a kind. His ability to put together a team of top-notch industry veterans and key partners has allowed TF Semi to accomplish in a few short years what would take most companies much longer under similar circumstances. Roger’s deep knowledge of device and process technology gives TF Semi an additional advantage over its competitors due to stronger design-device-process couplings.

Industry experts recognize Roger’s unique ability to see the business potential of technology and communicate that to his team and his customers. Roger transformed Telefunken Semiconductors America from a struggling semiconductor company to a technology specialty foundry leader (TSI) in the United States and an advanced green-energy oriented product design company (TF Semi) in Northern California. Roger’s vision for building a semiconductor solutions company to provide end-customers with both turn-key solutions and related IC chips is unique and out of box thinking. Roger’s foresight and dedication have transformed TF Semi from a once struggling division into a profitable standalone enterprise, and his experience and “hands-on, make it happen” management philosophy has made TF Semi grow to the third largest portfolio offering of PMIC gate drivers products in its category in just a few short years, with a portfolio of 100+ high performance devices. Many are being integrated into the solutions of Tier-1 companies around the world.

An example of how TF Semi can help its customers to produce high performance, efficient solutions is in E-Vehicle market. E-Vehicles is one of the biggest growth areas (market valued at $162.34 billion in 2019) in the Global PMIC Market. TF Semi targeted this market as well as conventional automotive electronics market and has found success supporting global OEM/ODM customers. For example, recently one customer requested an Automotive Qualified (AEC Q-100) solution for its critical in-cabin applications. TF Semi worked with the customer to meet their high-reliability requirements and provided the key IC driver product on schedule, meeting the end-customer’s requirement for launching in the new model-year. TF Semi continues to work with this customer to support their next generation development and technology goals.

TF Semi has just released its newest Generation “U” ICs. The new U family has additional features to help system designers bring more efficient and reliable products to market to meet customer’s growing demand for power efficient solutions. TF Semi’s next planned phase is the launch of the TF Ecosystem (TFES)--- a solutions platform which allows companies to partner with TF Semi on their projects from initial design, through proof-of-concept, to full mass production support. “In the next phase, companies will have the opportunity to use TF Semi’s extensive Solutions Support Network to bring their next project to market quickly and efficiently.” adds Roger.IE